Universidade Federal do Rio Grande do SulEngenharia Elétrica

Circuitos Eletrônicos Integrados – ENG04061

Testes de Circuitos Eletrônicos Integrados

Stevan SilveiraLeandro Prytula

Argus Luconi Rosenhaim

Site: www.amkor.comCriação: 1968Mercado: WorldwideEmpregados: 400 em Chandler, >22k worldwideLocalização: Matriz: Chandler AZ – USA – HeadquartersFiliais: China, Japão, Coréia, Filipinas, Singapura e Taiwan.

Expansão: Vê a necessidade de aumentar a capacidade de

produção para atender os clientes.

Amkor Technology, Inc.

Distribuição no mundo

Dados de Vendas

Amkor Technology, Inc.

Advanced Micro Devices, Inc. Marvell Technology Group, Ltd.Altera Corporation Mediatek, Inc.Analog Devices, Inc. NEC CorporationAtheros Communication, Inc. NXP SemiconductorsAtmel Corporation RF Micro Devices, Inc.Avago Technologies, PteSamsung Electronics Corporation, Ltd.Broadcom Corporation

Amkor Technology, Inc.

Sony Semiconductor CorporationConexant Systems, Inc. ST Microelectronics, N.V.Freescale Semiconductor, Inc. Texas Instruments, Inc.IBMToshiba CorporationInfineon Technologies AG Qualcomm IncorporatedIntel Corporation Xilinx, Inc.LSI Corporation

Principais clientes

Serviços: 1. Testes de desenvolvimento: Abrange o desenvolvimento de programas de teste, administração de projetos, caracterização, prototipação.2. Wafer Probe: Abrange a inspeção visual e teste elétrico do wafer contra defeitos antes do encapsulamento. 3.Testes Finais: Processo de ensaio de cada aparelho/circuito depois de ter sido encapsulado. Esse teste analisa os atributos de cada dispositivo e determina se ele atende aos critérios estabelecidos pelo cliente

* Os testes incluem circuitos digitais, lineares, sinais mistos, memórias, rádio frequência (especialidade da empresa) e integrações dessas tecnologias.

Amkor Technology, Inc.

Testes de desenvolvimento:

Amkor Technology, Inc.

•Project management process(s)•Rapid first article development•Advanced wafer probe•Low cost RF probe•Hardware (contactor, load board, probe card, handler kits)•Robust contacting solutions aligned with Amkor's bump and package roadmap•Novel test solution for low cost, bottom PoP (Package-on-Package)•SiP module test strategies (including in-line test)•Automation of system level test solutions•Program conversion•Multi-site test•Strip test for punch and saw devices (low mix / high volume)

Wafer Probe:

Amkor Technology, Inc.

•High volume production test for 300mm, 200mm and 150mm wafers•Full temperature range (-55oC to +150oC)•Thin wafer handling capabilities (<150um) •RF probe capabalities•DPS (Die processing services) •Clean room environment•Multi-site probe •Probe card repair capabilities•Bake retention•Bumped wafer probe

• Electronic Assembly Support: Die attach wafer mapping (ALPS) Edge dies exclusion Wafer map template generation Inkless probe Probe wafer mapping

Testes finais:

Amkor Technology, Inc.

•High volume production final test•Full temperature testing capabilities•Yield and capacity analysis•Highly skilled factory test engineering support •Wide range of test and handling equipment•Custom test processing - Commercial / Military flows and mark after tests•High volume strip test

Equipamentos de teste

Amkor Technology, Inc.

ATEMixed Signal RF Digital Memory

Verigy 93000 x x x

Advantest T2000 x x x

Teradyne Flex & UltraFlex x x x

Teradyne Catalyst x x x

Teradyne J750 x x

LTX, CX & MX x x

Credence ASL3K, ASL1K x x

Eagle 364 x

Teradyne NexTest Maverick x

Teradyne NexTest Magnum x

Amkor RFT x

LT / Duo / Quartet x x

Testes completos

Amkor Technology, Inc.

Comunicação:•GPS, DVB-H, T-DMB, ISDBT receivers, demods, base bands, SiP, SCSP•Dual sided PoP ( package on package ) contactors, 2G / 3G baseband•Advanced media processor SoC(s)•Quadsite celluar Tx front end SiP modules•GPS receiver and baseband•BlueTooth SoC radio RF probe – WLCSP die sales •Multiple die / system in package solutions for OEM(s)•Cellular power amplifier + transceiver modules, SiP, HEDGE•LNA , Video Amplifiers & Drivers•Noise cancellation

Consumidores:•Biometric sensors, MEMS, Quad site fingerprint sensor •x16 Power FET & Op Amp solutions •MOSFET strip test •x32 Memory Card solutions •LVDS timing controller  LCD/PDP display •Image stabilizer & processors, digital still camera (DSC) •USB2.0  / MP3 processor •Hard disc controller •Microcontrollers •Compass IC

Site: www.waferinspectionservices.com Local: Orleans MA - USA

Criação: 1986Mercado: Worldwide

Empregados: < 50

Wafer Inspection Services, Inc.

Serviços:

Wafer Inspection Services, Inc.

•Audits•Installations•Deinstallations•Operator Training•Applications Training•Technical Support•Preventive Maintenance•Maintenance Training•Per Call Service•Full time On Site Service

Serviços:

Wafer Inspection Services, Inc.

•NIST Calibration Wafers (PSLs)•NIST Thin Films Calibration Wafers•JDSU New Lasers •SP2 remanufactured lasers•Replacement Lamps•Robotics service / repair•PRI/Equipe, Ludl, Kensington

Site: www.maxtek.comLocal: Beaverton, OR – USACriação: 1970, juntamente com a Tektronix

Maxtek Components Corp.

Serviços:

•Package Design – Ensuring Your Product's Success •Test Services – Verifying Your Component Performance•Manufacturing – US-based Assembly of Your Components•Reliability & Failure Analysis – Identifying and Eliminating Potential Failures•Project Management – From Design to Finished Component

Maxtek Components Corp.

Site: www.bridgept.com - em contrução

Local: Austin, TX - USA

BridgePoint Technical Manufacturing

Serviços:

BridgePoint Technical Manufacturing

•Test Development •Product Engineering •Probe/Final Manufacturing Test•Burn-in•Custom device programming, Inventory•Electronic Assembly•Product Analysis