3Dtronic - Apresentação 2015

Confidential - 3Dtronic - 2015

3Dtronic

Presentation: 3D-MID Technology Molded Interconnect Device

3Dtronic Mission

• Support the Brazilian Electronic Industry to develop products using MID Technology by providing Education, Design and Prototyping services of MID products and devices.

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3Dtronic Services

• Consulting for redesign and new products

• Design Specification

• Mechanical and Electronic Design

• MID Prototyping

• Debug and tests

• Design Documentation

• 3D-MID Training Services


Electronics Devices Importation

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In US$Million, includind MID Devices Source: ABINEE


Trade balance of electrical and

electronic products

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In US$Billion, due to absence of technology Source: ABINEE


Millions of MID Antennas

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Source: ABINEE


Molded Interconnect Devices

• The use of high temperature thermoplastics and their structured metallization opens up a new dimension of circuit carrier design to the electronic industry: Molded Interconnect Devices (MID). MID are injected molded thermoplastic parts with integrated circuit traces.


Industrial Applications for 3D MID

Technology

• Automotive industry

• Medical technology

• Consumer electronics

• Computer technology

• Aircraft and space industry

• Household appliances

• Industry automatization

• Robotics and Mechatronics

• LED Lighting


Advantages

• Designing New Products Using 3-Dimensional Molded Interconnect Devices you can reduce:

– Size, weight and complexity of assemblies

– And to reduce Costs – through reduction in number of components, wires, interconnects and assembly time

• Improvements:

– Reliability

– Functionality


MID Process in Short

• Injection molding

• Laser processing (LDS)

• Metallization

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- LDS is a mature, robust technology

- Cell Phone Antenna production is

largest application, with ten’s of

millions produced annually

- Europe is currently experiencing

rapid growth in automotive, with

BMW taking the lead, medical

devices, antennas systems, sensors

and RF-ID tags


Market MID (LDS)

Source: LPKF Laser & Electronics AG


Applications - Communication

• Antenna for cell phones, tablets, computers and Internet of Things


Applications - Automotive



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• TRW’s “Base-Line” MID after assembly:

Source: I&T 3D-Produktionsgesellschaft mbH



Former device

Diameter approx. 10mm

Prototype new Sensor

Diameter: 5mm

Realized by Flip Chip on

LPKF-LDS® MID

Source: Robert Bosch GmbH

Rotation Sensor for Automotive Brake System (ESP)

Final Part


Applications - Medical


Applications - RFID

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Source: Harting Mitronics AG

•RFID-Transponder


Applications – Micro Packaging


Applications – Ligthing


Applications – Others


Source: Multiple Dimensions AG

THANK YOU!

www.3dtronic.com.brOffice: +55 11 4473-1984

Mobile: +55 11 94125-5227Email: [email protected]

Confidential - 3Dtronic - 2015 27

http://www.3dtronic.com.br/

3Dtronic - Apresentação 2015

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